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Theme: Power Amp Design |
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Welcome to Wireless Chip Designer – the only newsletter that covers the challenges of integrating analog design, analog mixed signal and Wireless functionality into silicon. Please see below for address-change or subscribe/unsubscribe instructions. This Month's Table of Contents:
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Platinum Sponsor: Cadence What's your Power IQ? Prove your low-power prowess, challenge a friend, and learn something new. Take the Power IQ Test at www.cadence.com/lowpower |
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1. Viewpoint – ExclusiveInteroperable PCell Libraries Or Bust!By Michael Ma, Vice President of Business Development, Ciranova, (www.ciranova.com)
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What would you say to 35,000 advanced IC engineers?
Want a new approach in delivering your message to 35,000 advanced IC engineers? Try Chip Design's e-Newsletter "mini-series," which combines staff-written editorial along with your contributed content into a tantalizing 3 month long series of engaging technical discussions. View on-going and past mini-series at: http://www.chipdesignmag.com/enewsletters. For sponsorship information, contact Karen Popp at: kpopp@extensionmedia.com. The mini-series approach is a refreshing way to deliver content, white paper links and ads to your targeted audience! |
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2. NewsIC Design Services Industry GrowingIndia's IC design services industry will continue to grow at over 20 percent per year through 2010, reports In-Stat. Cost advantages and availability of skilled manpower have compelled integrated device manufacturers (IDMs) to either outsource part of their design activities to third-party design firms in India, or set up their own captive centers in the country. According to Mayank Jain, In-Stat analyst, "Indian design companies will continue to move up the value chain by increasingly accomplishing the entire design instead of doing piecemeal design work. Captive centers of IDMs work on cutting-edge technologies and contribute to the development of products for a global audience." |
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Gold Sponsor: Chip Design Trends
SOC Design...Market Analysis...Trends...Forecasts...Benchmarking |
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3. NewsRFICs Achieve Power Breakthrough For GSM Wireless MarketsFreescale Semiconductor has announced the industry's first two-stage RF Integrated Circuits (RFICs) capable of delivering the 100-watt RF output power required for GSM and EDGE network base stations. The devices are the highest power two-stage RFICs to be offered commercially. When driven by Freescale's cost-effective MMG3005N general purpose amplifier, the MWE6IC9100N and MW7IC18100N RFICs form a comprehensive 100-W power amplifier solution for wireless base stations operating at 900 and 1800 MHz. The advantages are significant for the GSM and EDGE market. Historically, the output power of two-stage RFICs has been limited to less than 30 W, relegating their utility to driver and pre-driver stages. Previous designs required a separate high power transistor to achieve the 50 dB of gain and the 100 W of output power typically required for GSM EDGE transmitters. Now, only a general purpose amplifier and a single RFIC combine to meet this requirement. |
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********* VISIT OUR SILVER SPONSOR *********
Silver Sponsor: ESC Silicon Valley ESC Silicon Valley, April 1-5, 2007 at the McEnery Convention Center |
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4. NewsComplete Low-Power Solution DeliveredCadence Design Systems has introduced the Cadence Low-Power Solution, the industry's first fully integrated flow for logic design, verification and implementation of low-power chips. It integrates leading-edge design, verification and implementation technology with the Common Power Format (CPF) - an Si2 format for specifying power-saving - techniques early in the design process, to deliver an end-to-end low-power design solution to IC engineers. By preserving low-power design intent throughout the design, the solution eliminates laborious manual work, reduces power-related chip failure and provides power predictability early in the design process. | |
5. NewsSynopsys Named IBM-Authorized Power Architecture Design CenterSynopsys signed an agreement with IBM that enables it to sub-license IBM's PowerPC 440 and 405 embedded microprocessor cores and associated peripheral cores directly to customers. As a newly authorized Power Architecture Design Center, Synopsys now offers sub-licenses that include the right for customers to manufacture system-on-chip (SoC) designs incorporating PowerPC cores at any foundry of their choosing. The IBM cores are available through the Synopsys DesignWare Star IP Program. With this agreement, Synopsys becomes the second Power Architecture Design Center outside of IBM's own business line, and the only independent supplier to offer Power Architecture cores, EDA tools, design services, and other IP elements to address a full range of design issues. Customers can now obtain all the key design elements they need to create a Power Architecture-based SoC for their targeted foundry directly from Synopsys. |
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Bronze Sponsor: Chip Estimate REDUCE your chip size, power and COST. |
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6. NewsStatistical Modeling Suite Rolled OutX-FAB Silicon Foundries in Erfurt, Germany, today completed the rollout of its statistical modeling suite for Monte Carlo simulation on its 0.6 and 0.35 micrometer analog/mixed-signal technology platforms. Using it, designers gain full flexibility to accommodate all variations associated with designing and manufacturing analog/mixed-signal ICs. The statistical models enable their designs to be more robust and meet performance specifications across a range of environmental conditions. 7. International NewsPartnership Signals Japan's A/MS Software DemandSolido Design Automation announced a strategic business partnership with Aisys Corporation in Japan. This partnership will accelerate Solido's technology adoption in the growing Japanese semiconductor design market by utilizing Aisys' customer relationships and their experienced skill-set as a virtual subsidiary. According to Amit Gupta, president and CEO of Solido Design Automation. "Aisys's relationships with the key analog/mixed-signal, custom digital and memory semiconductor companies have already proven to be of great value to Solido and will be an asset to our business expansion efforts in Japan." The combination of Aisys sales, consulting and systems integration services with Solido's technology will give Japanese customers an unparalleled solution for their analog/mixed-signal and custom digital and memory needs. |
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8. International NewsAgreement Extends Availability Of ARM ProductsDongbu Electronics and ARM today announced a license agreement that extends the availability of ARM low-power and speed-and-density products (part of the ARM Artisan physical IP family) to designers developing chips using Dongbu's CMOS process at the 130-nanometer node. The ARM physical IP portfolio is ideally suited to support system-on-chip (SoC) designs targeting mobile handset and portable consumer applications, and will be offered to Dongbu’s foundry customers at no charge via the ARM website. 9. In-Depth Coverage LinksAt 90 nm and below, avoiding IR drop and electromigration problems becomes a crucial aspect of SoC design. To learn more, read "Proper Planning Assures SoC Power Integrity." This paper compares and contrasts two types of PLLs, highlighting the benefits designers can exploit by using fractional PLLs in place of traditional integer solutions for system clocks. To learn more, read: "Inherent Benefits of a Delta-Sigma Fractional-N PLL in Power-Conscious SoC Designs." |
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10. New BooksSwitchmode RF Power Amplifiers |
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11. Happenings – ConferencesEmbedded Systems Conference China International Symposium on Quality Electronic Design (ISQED) PCB Design Conference West International Symposium on Quality Electronic Design Multicore Expo The International Wireless Communications Expo (IWCE) 2007 2007 Embedded Systems Conference Silicon Valley Design Automation and Test in Europe (DATE) Computerworld's 5th Annual Mobile & Wireless World Conference WOC 2007 Wireless and Optical Communications Conference Design Automation Conference (DAC) Semicon West 2007 |
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WIRELESS CHIP DESIGNER e-NEWSLETTER CONTACTS
Editor: Cheryl Ajluni, cajluni@extensionmedia.com Editorial Director: John Blyler, jblyler@extensionmedia.com Advertising/Sponsorship Opportunities: Karen Popp, kpopp@extensionmedia.com Read past issues of Chip Designer, FPGA Developer, IP Designer & Integrator, and Wireless Chip Designer : www.chipdesignmag.com/enewsletters To subscribe, or change your profile, visit: To unsubscribe, email: Visit Chip Design:
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