Two orders of magnitude productivity boost from FDTD on GPUs.
Entries Tagged as 'White papers'
200x Productivity Boost with FDTD on a GPU
February 7th, 2011 · No Comments · White papers
Advanced Layout Solutions Solves High Speed Digital Challenges Using ADS
September 10th, 2010 · No Comments · White papers
White paper on how Advanced Layout Solutions, the largest Allegro design bureau in the UK, uses ADS in conjunction with Allegro to add the multi gigabit EM solvers and circuit simulators that Allegro by itself lacks.
Tags: FDTD·FEM·method of moments
Dielectric Bricks, Laminates, LTCC 3DEM Simulations
June 16th, 2010 · No Comments · White papers
Often 3D planar EM simulation technology is adequate for most laminate/LTCC/module applications; however there are cases were full-wave 3D EM simulations provide better accuracy. This episode discusses two such applications and the advantages of using FEM Simulator G2.
Tags: EM Insights Series·finite element method·method of moments
Solder/Wafer Bumps for Flip-Chip, CSP, and WLP Applications
March 24th, 2010 · No Comments · White papers
Integrated 3D EM in the design tool avoids the time-consuming and error-prone process of using a separate point tool
Tags: chip-scale package·flip-chip·solder bumps·wafer bumps·wafer-level package
SATA Connector Model in High Speed Digital Design
March 9th, 2010 · 2 Comments · White papers
How to bring a model of a SATA connection into a circuit simulator in order to optimize system performance around it?
Tags: connector·EM Insights Series·FDTD·high-speed digital·SATA
HDMI Connector Optimization
February 25th, 2010 · No Comments · White papers
Optimize a 10.2 Gb/s HDMI connector with FDTD EM simulation
Tags: connector·EM Insights Series·FDTD·HDMI·high-speed digital
Using EM to Design DGS Structures
February 1st, 2010 · No Comments · White papers
A Defective Ground Structure (DGS) is an intentionally designed defect on a ground plan, which creates additional effective inductance and capacitance. This technique can be used to design microstrip lines with desired characteristics such as higher impedance, band rejection and slow-wave characteristics, while significantly reducing the footprint of the microstrip structure. DGS structures are used [...]
Tags: defective ground structure·DGS·EM Insights Series
BGA Package Simulation
January 4th, 2010 · No Comments · White papers
A BGA package is very popular package style for high speed digital applications due to high density, low thermal resistance, and low inductance leads. However, a package is
the second most expensive part next to the silicon and can add 6 to 8 weeks to the cycle time. Given the very tight opportunity window for the [...]
Tags: BGA package·EM Insights Series
Contactor Design in High Volume RF Test Fixtures
December 24th, 2009 · 1 Comment · White papers
This episode demonstrates how FDTD EM simulations helps you to quickly analyze and understand the impact of the contactors to the overall test performance, consequently the production yield.
Tags: contactor·EM Insights Series·FDTD·high-speed digital·test fixture
Wireless Network Card Antenna Design
December 21st, 2009 · No Comments · White papers
How to use FDTD EM simulation to design a wireless network card antenna that is ~40% smaller in area, with no compromise in performance or cost.
Tags: antenna·EM Insights Series·FDTD·wlan


