Wizards of Electromagnetism

Helping Engineers Become "Wizards of Electromagnetism"

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Entries Tagged as 'White papers'

200x Productivity Boost with FDTD on a GPU

February 7th, 2011 · No Comments · White papers

Two orders of magnitude productivity boost from FDTD on GPUs.

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Advanced Layout Solutions Solves High Speed Digital Challenges Using ADS

September 10th, 2010 · No Comments · White papers

White paper on how Advanced Layout Solutions, the largest Allegro design bureau in the UK, uses ADS in conjunction with Allegro to add the multi gigabit EM solvers and circuit simulators that Allegro by itself lacks.

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Dielectric Bricks, Laminates, LTCC 3DEM Simulations

June 16th, 2010 · No Comments · White papers

Often 3D planar EM simulation technology is adequate for most laminate/LTCC/module applications; however there are cases were full-wave 3D EM simulations provide better accuracy. This episode discusses two such applications and the advantages of using FEM Simulator G2.

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Solder/Wafer Bumps for Flip-Chip, CSP, and WLP Applications

March 24th, 2010 · No Comments · White papers

Integrated 3D EM in the design tool avoids the time-consuming and error-prone process of using a separate point tool

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SATA Connector Model in High Speed Digital Design

March 9th, 2010 · 2 Comments · White papers

How to bring a model of a SATA connection into a circuit simulator in order to optimize system performance around it?

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HDMI Connector Optimization

February 25th, 2010 · No Comments · White papers

Optimize a 10.2 Gb/s HDMI connector with FDTD EM simulation

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Using EM to Design DGS Structures

February 1st, 2010 · No Comments · White papers

A Defective Ground Structure (DGS) is an intentionally designed defect on a ground plan, which creates additional effective inductance and capacitance.  This technique can be used to design microstrip lines with desired characteristics such as higher impedance, band rejection and slow-wave characteristics, while significantly reducing the footprint of the microstrip structure.  DGS structures are used [...]

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BGA Package Simulation

January 4th, 2010 · No Comments · White papers

A BGA package is very popular package style for high speed digital applications due to high density, low thermal resistance, and low inductance leads. However, a package is
the second most expensive part next to the silicon and can add 6 to 8 weeks to the cycle time. Given the very tight opportunity window for the [...]

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Contactor Design in High Volume RF Test Fixtures

December 24th, 2009 · 1 Comment · White papers

This episode demonstrates how FDTD EM simulations helps you to quickly analyze and understand the impact of the contactors to the overall test performance, consequently the production yield.

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Wireless Network Card Antenna Design

December 21st, 2009 · No Comments · White papers

How to use FDTD EM simulation to design a wireless network card antenna that is ~40% smaller in area, with no compromise in performance or cost.

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