Wizards of Electromagnetism

A BGA package is very popular package style for high speed digital applications due to high density, low thermal resistance, and low inductance leads. However, a package is
the second most expensive part next to the silicon and can add 6 to 8 weeks to the cycle time. Given the very tight opportunity window for the majority of digital products, a failure to produce a successful package design can significantly reduce the profit margin or even kill the entire project.

Problem: Designers are challenged to get the desired BGA package performance right the first time.

Action: Method-of-moments EM simulation gives fast and accurate analysis of 45 mm BGA package designed in Cadence APD. Critical nets were imported into ADS using its Allegro Design Flow Integration capability.

Result: Simulated results showed candidate configuration would give acceptable s-parameter perfomance. Subsequent measurements confirmed the accuracy of this prediction and the acceptability of the solution.

Read the full details in our presentation EM Insights Series – Episode 5 – BGA Package Simulation

See the full series at EM Insights Series