Archive for July, 2010

Jul 30 2010

Semicon 2010 – services lead the way

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At this year’s Semicon West, there was a resurgence of attendees.  Both the Semicon floor and the areas for the InterSolar show were equally as crowded as a shift the 2009 show.  A change on the Semicon floor was the lack of big iron hardware from the folks in litho and furnaces.  Most of the big equipment existed in videos, photos and product slicks and were being primarily discussed in the exhibitor meeting areas rather than on the show floor.
As the process geometries have shrunk to below 40nm for the cutting edge processes, the number of fab interested in the equipment for those lines has decreased.  As a result, the equipment was being presented not only on the processing geometry target, but also on cost of operation.  Tokyo Electron Ltd. (TEL) was showing the GREEN aspects of their technology.  Their commitment to the environmental impact – power utilization, waste, maintenance is now a major corporate directive.  This directive is uniform over their MEMS, semiconductor processing, flat panel display and PV production equipment.
The areas with the biggest crowds at the show had to do with the service sectors.  The outsource model is continuing to drive through the supply chain.  Major equipment suppliers are offering processing services, as well as new companies offering wafer sort, package test, and advanced failure analysis services.  More aspects of the semiconductor design and manufacturing flow from IP through test/burn-in are now available though services and the expo floor is becoming the new stage for these providers.
PC

At this year’s Semicon West, there was a resurgence of attendees.  Both the Semicon floor and the areas for the InterSolar show were equally as crowded as a shift the 2009 show.  A change on the Semicon floor was the lack of big iron hardware from the folks in litho and furnaces.  Most of the big equipment existed in videos, photos and product slicks and were being primarily discussed in the exhibitor meeting areas rather than on the show floor.

As the process geometries have shrunk to below 40nm for the cutting edge processes, the number of fab interested in the equipment for those lines has decreased.  As a result, the equipment was being presented not only on the processing geometry target, but also on cost of operation.  Tokyo Electron Ltd. (TEL) was showing the GREEN aspects of their technology.  Their commitment to the environmental impact – power utilization, waste, maintenance is now a major corporate directive.  This directive is uniform over their MEMS, semiconductor processing, flat panel display and PV production equipment.

The areas with the biggest crowds at the show had to do with the service sectors.  The outsource model is continuing to drive through the supply chain.  Major equipment suppliers are offering processing services, as well as new companies offering wafer sort, package test, and advanced failure analysis services.  More aspects of the semiconductor design and manufacturing flow from IP through test/burn-in are now available though services and the expo floor is becoming the new stage for these providers.

PC

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