Comments on: Network ICs – packaging is a key design element http://www.chipdesignmag.com/pallab/2010/02/05/network-ics-packaging-is-a-key-design-element/ EDA and Semiconductor Insights Thu, 26 May 2011 17:25:18 +0000 hourly 1 http://wordpress.org/?v=3.2.1 By: Hillol Sarkar http://www.chipdesignmag.com/pallab/2010/02/05/network-ics-packaging-is-a-key-design-element/comment-page-1/#comment-7843 Hillol Sarkar Wed, 10 Feb 2010 18:03:49 +0000 http://www.chipdesignmag.com/pallab/?p=235#comment-7843 Package is the second most expensive part next to Silicon. It requires accurate Transmission Line Analysis and optimization. AgO has developed Advanced Algorithm to optimize Analog and RF circuits. It works with Spice Simulators. AnXplorer Design Data base after optimization can enhance the alternative desired performance of Package IC integration path. Package simulation is a complex process and Integrated tools are not available. Optimization can solve the manual trial and error method. We have given an overview of the technology. http://bit.ly/d-pre http://www.cst.com/Content/Applications/Article/IC+Package+Simulation Above link has some useful discussion about transmission line simulation. Hillol Sarkar Package is the second most expensive part next to Silicon.
It requires accurate Transmission Line Analysis and optimization.
AgO has developed Advanced Algorithm to optimize Analog and RF circuits.
It works with Spice Simulators. AnXplorer Design Data base after optimization can
enhance the alternative desired performance of Package IC integration path. Package simulation
is a complex process and Integrated tools are not available. Optimization can solve the manual
trial and error method. We have given an overview of the technology. http://bit.ly/d-pre

http://www.cst.com/Content/Applications/Article/IC+Package+Simulation

Above link has some useful discussion about transmission line simulation.

Hillol Sarkar

]]>