Apr 22 2009
Cadence Implementation Products Group – Q2 ‘09
Dr. Chi-Ping Hsu is the Sr. VP of R&D of the Implementation Products Group at Cadence. Dr. Hsu come to this position at Cadence from key technology leadership positions at Get2Chip and Avanti. Under the current version of organization, this group is responsible for several product areas – CIC: Virtuoso and other custom physical design tools, CSV: Simulators and DFM/Litho products, ICD: Place & Route / Signal Integrity / Timing, and SPB: PCB / SIP and Packaging. The group is also responsible for several industry initiatives – the long standing Open Access (OA) database initiative, the Power Forward Initiative and the new Mixed Signal Initiative.
The reorganization is centered around the strength of the new anchor products. The feature sets in IC 6.1.3 that are part of the open access versions of Virtuosos and EDI (Encounter Digital). These tools while incompatible with prior design data from version 5.1.41, has been receiving strong responses from customers who have chosen to recreate designs from the ground up in the new tools and simulate them with the new simulator.
The new environment also hosts a new line of multi-threaded and multi-core aware simulators that are a departure from their traditional single core products. These multi-core products provided increased throughput of 12-20x over the single threaded products.
The current flagship of the new product is the low power solutions under the common power format. The low power solutions both in products and services are an integral portion of the revised Cadence design platform. It is addressing the advanced process marketplace in the low power SOC application space that does not rely on legacy data, so entry into the new tools and new simulators is not an issue. The use of the new tools results in the use of new flows and new services and support infrastructure. On this basis, Cadence sees a strong business case for those that choose to adopt the IC6.1.3 platform or the Low Power Solution/CPF format.
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