DOT.ORG

Model OCP Interfaces in SystemC

Standards are being built on top of OSCI’s TLM-2 technology. [ Published in April / May 2009 issue of Chip Design Magazine ]

Industry Standards Should Facilitate Multicore Adoption

[ Published in January / February 2009 issue of Chip Design Magazine ]

GSA Mixed-Signal/RF Subcommittee Is Facilitating an Analog Ecosystem

[ Published in October / November 2008 issue of Chip Design Magazine ]

[Dot.org] The Second Commandment for Effective Standards

[ Published in April/May 2008 issue of Chip Design Magazine ]

[DOT.ORG] Margin Myopia Blurs Chip Supply-Chain Future

[ Published in March 2008 issue of Chip Design Magazine ]

[Dot.org] Debug Grows Increasingly Critical

[ Published in January/February 2008 issue of Chip Design Magazine ]

[ Dot.Org ] Kick-Starting RTL Power-Aware Verification

[ Published in October/November 2007 issue of Chip Design Magazine ]

[ Dot.Org ] The Unified Power Format -- A Standard Done the Right Way

[ Published in August/September 2007 issue of Chip Design Magazine ]

[ Dot.Org ] Integration and Power Highlight Latest Standards

[ Published in June/July 2007 issue of Chip Design Magazine ]

[ Dot.Org ] Power To The People

Power.org Grows with Major Players [ Published in April/May 2007 issue of Chip Design Magazine ]

[ Dot.Org ] EDA Standards: Have We Learned Our Lessons?

[ Published in February/March 2007 issue of Chip Design Magazine ]

[ Dot.Org ] In Search of the Holy Grail: Making Chips Cost Effective, Power Efficient, and Faster

[ Published in December 2006/January 2007 issue of Chip Design Magazine ]

Time To Market Drives SoC Design To Higher Levels Of Abstraction

[ Published in October/November 2006 issue of Chip Design Magazine ]

DOT.ORG: SystemVerilog: The Front Wave of Success

[ Published in June/July 2006 issue of Chip Design Magazine ]

DOT.ORG: Introducing CEDA: An Organization for the CAD Community

[ Published in April/May 2006 issue of Chip Design Magazine ]

DOT.ORG:   Security: It's Not Just Encryption

[ Published in February/March 2006 issue of Chip Design Magazine ]

It's Been A Busy Year for EDA and Semicon Organizations

[ Published in December 2005/January 2006 issue of Chip Design Magazine ]

Aggregation Drives Successful IP Reuse

By helping IP providers and integrators assess IP quality, aggregators can ensure reusability while minimizing customer modification for different chips. [ Published in Aug / Sept 2005 issue of Chip Design Magazine ]

IP Reuse Gets a Reality Check

The selection and packaging of IP have been significantly improved with the VSIA's "apples-to-apples" Quality IP metric. [ Published in June / July 2005 issue of Chip Design Magazine ]

SPIRIT: Structure for Packaging, Integrating, and Re-Using IP within Tool Flows

By looking to quickly produce usable IP-integration standards for SoC development, this organization has achieved many of its original goals. [ Published in April / May 2005 issue of Chip Design Magazine ]

Si2: Innovation Through Collaboration

Flexibility is showing the organization a new way to help EDA and semiconductor companies address [ Published in December / January 2005 issue of Chip Design Magazine ]

PCI-SIG: Several Years of Innovation

Both 2003 and 2004 are proving to be prolific years for the organization [ Published in October/November 2004 issue of Chip Design Magazine ]

Dot.Org--The Metrics of Success

[ Published in July/July 2004 issue of Chip Design Magazine ]

Dot.Org--Open Core Protocol: The SystemC Models

The System Level Design Working Group producestransactional models for the OCP 2.0 specification [ Published in April/May 2004 issue of Chip Design Magazine ]

Dot.Org--Addressing the IP Quality Problem

FSA and VSIA link hands to tackle the issue [ Published in February/March 2004 issue of Chip Design Magazine ]

Dot.Org--A Fresh Look at the New Si2

Working to generate standards that add value to the industry. [ Published in December/January 2004 issue of Chip Design Magazine ]

Dot.Org--Quality IP [QIP]

VSIA releases a tool to quantify [ Published in October/November 2003 issue of Chip Design Magazine ]