Well, whether or not it becomes a debate is up-in-the-air, but there will be a Wednesday morning breakfast roundtable during DAC on the topic, “Can IP Integration be an SoC Methodology or is it Always Ad-Hoc?� that should be very interesting.
Most of the IP integration community agrees that implementing third-party silicon IP on a chip is generally not easy, due to a variety of reasons including the lack of standardization in both accessing IP quality and actually putting it on a chip. However, is this permanent or just a temporary situation?
The roundtable will be moderated by Ron Wilson, Executive Editor of EDN, who will be sure to keep the roundtable participants, including yours truly, honest and in line. The four participating companies, besides Sidense, include ChipEstimate.com, Synopsys and Tensilica. Ron will have some probing questions, concerning how to search for “good� third-party IP and how to optimize IP vendor and user efforts for IP integration and verification, at the ready, but the idea is to have YOU bring up your concerns and opinions to us.
So – if you would like to mix breakfast and a little business, drop by the Hilton Hotel at 8AM Wednesday to see if turnkey IP is a myth or a future reality. You can pre-register at http://www.sidense.com/index.php?option=com_facileforms&Itemid=59&lang=en or just come on by. Yes – I do have my own opinion about turnkey IP, but you will have to come to the breakfast to hear it.