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Common Platform Technology Forum 2008
September 30, Santa Clara, CA
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The race to get the next hot product released never stops, and competition is relentless. Developing the next advancement in any marketplace has always been a combination of technical savvy, business agility, and marketing. Everyone realizes a smoking hot microprocessor or the coolest new mobile handset requires a synergy of planning, foresight, and technical horsepower. Market leadership is not a coincidence. Further, the people and companies that lead in their marketplace have long understood that one of the pillars of their success is continual investment in verification. Just as with design, effective verification requires planning and technical savvy.
Common components of advanced, front-end verification environments contain various mixtures of constrained random testbenches, coverage analysis, assertions, and hardware based solutions. Why are these solutions so common? They have provided a measurable return on investment (ROI) to the process of product development. ROI is a common rule of measurement for hiring an engineer, purchasing a higher-mileage automobile, and deploying new verification techniques.
Full Story >> http://www.chipdesignmag.com/display.php?articleId=2558
Finding it difficult to justify the costs of high-end design systems?
Tanner EDA has established itself as a crucial link in the process of designing Analog/Mixed-Signal ICs and ASICs. We provide fully-integrated solutions for schematic capture, simulation, physical layout, netlist extraction, LVS/DRC verification on Linux and Windows® PC platform.
(626) 471-9701 or http://www.TannerEDA.com/dm/cdNL1
Tensilica has announced that the new Intel Media Processor CE 3100 for Internet-connected CE devices will include its HiFi 2 audio processor. Tensilica's HiFi 2 processor is optimized to run more than 50 audio software packages, including AACPlus, MP3, SRS TruSurround HD, WMA, and G.7xx Voice codecs, along with the complete suites of Dolby and DTS codecs required for set-top box and Blu-ray Disc applications. System designers integrating Intel's Media Processor CE 3100 into new generations of set-top boxes, media players, and televisions can capitalize on a large library of optimized HiFi 2 audio software codecs that will be available directly from Intel.
Tensilica >> http://www.tensilica.com/
EVE is the leader in Hardware/Software Co-Verification. Nine of the top 10 semiconductor companies rely on ZeBu to verify their SOCs. With the best ROI on the market, ZeBu is also the choice of startups that need first-pass silicon success.
Eve >> EVE
Agilent Technologies has announced an integrated design-flow solution that includes 3D EM simulation for RF module design. The EMDS-for-ADS is a 3D electromagnetic simulator that's integrated into Agilent's Advanced Design System EDA software platform. EMDS-for-ADS accounts for the finite dielectric boundaries of RF modules as well as verifying the accuracy of faster Planar EM simulators. EMDS-for-ADS also features a finite element mesher and high-capacity iterative solver for RF SIP and RF module designs. EMDS-for-ADS helps designers accurately predict the 3D EM interactions of embedded passive components in RF modules, while co-simulating with active circuits to maximize the wireless sub-system performance.
Agilent Technologies >> http://www.agilent.com/
Supporting the growing number of avionics and military applications requiring DO-254-certifiable components, Altera and Mentor Graphics have announced they are working together to develop tools and methodologies for use in creating DO-254-certifiable IP that targets Altera's FPGA and HardCopy ASIC solutions. Mentor will leverage its design and verification solutions in the development of DO-254-certifiable IP. Mentor also offers DO-254 compliance training, design methodology assessments, and consulting services, including a DO-254 Jumpstart package aimed at establishing advanced verification methodologies for DO-254 designs. Altera, through its DO-254 Global Partner Network, currently offers a safety-critical version of its Nios II embedded processor. The certification aspects of this core were developed by HCELL Engineering using Mentor tools.
Altera >> http://www.altera.com/
Mentor Graphics >> http://www.mentor.com/
National Semiconductor has introduced three new operational amplifiers with integrated electromagnetic interference filters that maintain the accuracy of analog systems by reducing the effects of radio frequency interference. The LMV83x op amps deliver an EMI rejection ratio (EMIRR) of 120dB. They also feature 3MHz unity gain bandwidth, while operating on 240uA of supply current, yielding a power-to-performance ratio of 80uA per MHz. The LMV831 single, LMV832 dual, and LMV834 quad EMI-hardened op amps minimize the need for metal shielding, filters, and extra components. They are designed for use in phone accessories, medical instruments, precision weigh scales, and other industrial electronic equipment that is sensitive to electromagnetic disturbance in noisy environments.
National Semiconductor >> http://www.national.com/
Arbor Technology has launched the T0660, a fanless touch-panel PC with 1GB of onboard system memory and support for the low-power AMD LX900 CPU. In addition to the HMI market, the T0660 is designe for POS, POI, and automation applications. T0660 includes an onboard Ethernet controller, two USB 2.0 ports, three serial ports, a CompactFlash socket, a CAN bus, and PC/104 compatibility. T0660 uses advanced low-reflection touch technology, and its flexible design makes it appropriate for varying environments, such as wall-mounts, panel-mounts, desktop stands, or VESA arm mounts. The T0660 is suitable for common industrial applications, including factory automation and production process control, and non-industrial applications, including vending machine and parking lot automation.
Arbor Technology >> http://www.arbor.com.tw/
STMicroelectronics and Ericsson have announced an agreement to merge Ericsson Mobile Platforms and ST-NXP Wireless into a joint venture. The venture will offer semiconductors and platforms for mobile applications, supplying Nokia, Samsung, Sony Ericsson, LG, and Sharp. ST will contribute its multimedia and connectivity solutions as well as a complete 2G/EDGE platform and 3G offering, including customer relationships with Nokia, Samsung, and Sony Ericsson. Ericsson contributes its 3G and LTE platform technology as well as customer relationships with Sony Ericsson, LG, and Sharp. The complementary product portfolios are expected to deliver significant scale and synergies by leveraging and expanding the existing strategic cooperation between Ericsson Mobile Platforms and ST-NXP Wireless.
Ericsson >> http://www.ericsson.com/
STMicroelectronics >> http://www.st.com/
Through transaction-level modeling, emulation can be integrated with SystemV Methodology to create a high-performance functional-verification platform. To learn more, read Alain Raynaud’s “SystemVerilog Meets Emulation.”
Chip Design Editorial Feature >> http://www.chipdesignmag.com/display.php?articleId=2436
Today’s chip-level circuit simulation environment needs to be able to attach IC package technology to the chip design. To learn more, read Taranjit Kukal and Keith Felton’s “‘Chips-in-a-SiP’ Are a Circuit Simulation Headache.”
iDesign Editorial Feature >> http://www.chipdesignmag.com/display.php?articleId=2458
A Signal Integrity Engineer's Companion: Real-Time Test and Measurement and Design Simulation
By Geoff Lawday, David Ireland, and Greg Edlund
ISBN: 0131860062
Publisher: Prentice Hall PTR (Safari Books)
A Signal Integrity Engineer's Companion covers the life cycle from feasibility to verification and simulation to test. The book is set up as a practical guide to modern signal integrity test and measurement for high-speed digital designs. It includes detailed, start-to-finish case studies that guide engineers through commonly encountered design challenges. The book covers embedded system design from specification and simulation onward, illuminating key techniques and concepts with accompanying illustrations. Aimed at electrical engineers, signal integrity engineers, and chip designers, A Signal Integrity Engineer's Companion shows readers how to use real-time test and measurement instruments and techniques to address increasingly difficult interoperability and compliance requirements.
Prentice Hall PTR (Safari Books) >> http://safari.phptr.com/
Micro Nano Breakthrough Conference 08
Hilton Vancouver Washington, Vancouver, WA
September 8-10, 2008
http://www.micronbc.org/
International System-on-Chip Conference
Radisson Hotel, Newport Beach, CA
September 17-20, 2008
http://www.ieee-socc.org
IEEE Custom Integrated Circuits Conference
DoubleTree Hotel, San Jose, CA
September 21-24-, 2008
http://www.ieee-cicc.org/
OctoberBest '08
Tektronix, Beaverton, OR
September 24, 2008
http://www.octoberbest.com/
GSA IP Conference
Sept 24-25, 2008
Convention Center, Santa Clara, CA
http://www.gsaglobal.org/events/2008/0924/agenda.asp
International Conference of Computer Design (ICCD)
Resort at Squaw Creek, Lake Tahoe, CA
October 12-15, 2008
http://iccd.et.tudelft.nl/
Intel Developer Forum
Taipei, Taiwan
October 20-21, 2008
http://www.intel.com/idf/
Embedded Systems Conference Boston
October 27-30, 2008
Hynes Convention Center, Boston, MA
http://www.embedded.com/esc/boston/
International Test Conference (ITC 2008)
Santa Clara, CA
October 28-30, 2008
http://www.itctestweek.org/
International System-on-Chip Conference
Radisson Hotel, Newport Beach, CA
November 5-6, 2008
http://www.savantcompany.com/SoC6-Nov08/main.htm
International Conference on Computer-Aided Design (ICCAD)
DoubleTree Hotel, San Jose, CA
November 10-13-2008
http://www.iccad.com/2008/
IEEE Globecom 2008
Hilton Washington, Washington DC
November 30-December 4, 2008
http://www.ieee-globecom.org/2008/
FPGA Summit
Wyndham Hotel, San Jose, CA
December 10-11, 2008
http://www.fpgasummit.com/
IEEE Sensor Applications Symposium
Royal Sonesta Hotel New Orleans, New Orleans, LA
February 17-19, 2009
http://www.sensorapps.org/
*** September 15, 2008: Abstract submission deadline ***
AdvancedTCA Summit Europe
Munich, Germany
April 1-2, 2009
http://www.euroatcasummit.com/
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