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To help reduce the heat and power dissipation problems associated with increasing clock frequencies, the electronics industry has embraced multicore processing on SoCs. When correctly designed, using multiple processing engines lets chip designers increase computational cycles and, hence, total processing power per watt, something that increasing the system clock cannot accomplish. However, having multiple processing cores on a chip results in increased communication problems between the processors, other IP cores, and memories, both on and off the chip. Many of these problems are caused by using old-style, traditional hierarchical clock-based buses for these communication channels.
Clocked control of data flow on a multicore processor chip, with data moving between IP cores on a clock edge, presents a far more complex problem set than does a chip with a single processing engine. The use of hierarchical bus architectures to address the different data transfer and...
Full Story >> http://www.chipdesignmag.com/display.php?articleId=2225
EVE is the leader in Hardware/Software Co-Verification. Nine of the top 10 semiconductor companies rely on ZeBu to verify their SOCs. With the best ROI on the market, ZeBu is also the choice of startups that need first-pass silicon success.
Eve >> EVE
Kontron has announced the nanoETXexpress computer-on-module, based on the low power Intel Atom processor. The “nano” form factor is designed as an extension to the COM Express specification. The nanoETXexpress-SP is about the size of a credit card (55mm x 84 mm). The Intel Atom processor offers clock speeds between 1.1GHz and 1.6GHz; the Atom processor and single-chip chipset (22 x22 mm) have a TDP of less than 5W. The nanoETXexpress-SP is designed for the next generation of ultra-mobile applications, including handheld devices for medical or multi-media applications, small mobile data systems, and other new applications that have not been developed due to size and power constraints.
Kontron >> http://www.kontron.com/
True Circuits offers a complete family of PLLs and DLLs
Our clock generator, deskew, low bandwidth, spread spectrum and high resolution PLLs and DDR DLLs are high-quality, low-jitter, silicon-proven hard macros. They are available for immediate delivery in a range of frequencies, multiplication factors, sizes and functions in TSMC, UMC, CHRT and Common Platform processes from 180nm to 55nm. Call (650) 949-3400 or visit the timing experts at http://www.truecircuits.com/cd5.
Freescale Semiconductor has announced an integrated dual-core SoC device, expanding its Power Architecture technology processors for embedded design. A member of Freescale's mobileGT processor family, the MPC5123 is designed to simplify embedded Linux OS-based product development and reduce power requirements and system cost for industrial and consumer applications. The processor combines a Power Architecture e300 core, scaling to 400MHz with an advanced multimedia co-processor. The processor is bundled with a Linux-based starter kit. Manufactured on Freescale's advanced 90nm, low-power CMOS technology, the MPC5123 device is designed for cost-sensitive applications that require high performance, multimedia capabilities, and versatile connectivity options.
Freescale >> http://www.freescale.com/
Mixel is a leading provider of mixed-signal IP cores to the IC and electronics industries.
Mixel >> Mixel
RMI Corporation has announced the RMI Axcel PC3104 network accelerator card, an XLS-based PCIe platform. The Axcel PC3104 is designed for applications requiring line-speed gigabit network packet processing in a single PCI Express slot. Using the XLS multi-core, multi-threaded MIPS64 ISA network processor, the card delivers deep packet inspection, general-purpose processing, Autonomous Security Acceleration Engine technology, and a compression engine. Four gigabit Ethernet ports on the RMI Axcel front panel plus two on-board for internal system use provide for redundant external Ethernet connections as well as optional high-speed board-to-board interconnect. Optional on-board bypass for the four front panel ports ensures that Ethernet traffic continues to flow in the event of system failure.
RMI Technologies >> http://www.rmicorp.com/
Advanced Analogic Technologies has announced the AAT2601, a power management IC designed for mid-tier CDMA handsets. Integrating a single-cell Lithium-ion battery charger, a 300mA step-down converter, five low dropout (LDO) regulators, a reset function, and an I(2)C interface, the AAT2601 is designed to supply the power requirements of next-generation CDMA handsets. The battery charger in the AAT2601 is dynamic and can power the system while charging the battery. This thermally regulated constant current plus constant voltage linear charger combines a pass device, reverse blocking protection, high accuracy current and voltage regulation, charge status, and charge termination functions. Charging current, charge termination current, and recharge voltage are programmable via an external resistor or by a standard I(2)C interface.
AnalogicTech >> http://www.analogictech.com/
Semiconductor Manufacturing International and the Hong Kong Applied Science and Technology Research Institute (ASTRI) have announced their partnership to provide a dual-mode UWB MAC IC using SMIC's 0.13um mix-mode CMOS technology. The UWB MAC ASIC is a WiMedia Compliant UWB MAC IC supporting both Wireless Link Protocol (WLP/WiNET) and Information Group Resource Sharing (IGRS) standard networking applications. Included in the ASIC design are advanced multi-hop connectivity and video/audio quality of service features. This ASIC targets wireless personal area networking applications, letting electronic manufacturers create innovative, high speed, intelligent, and seamlessly connected wireless multimedia consumer products.
SMIC >> http://www.smics.com/
ASTRI >> http://www.astri.org/
Applied Micro Circuits has announced the Arches dual-processor reference design kit for its Power Architecture 460GT processor. The Advanced Mezzanine Card industry-standard solution supports systems based on Serial RapidIO, Gigabit Ethernet, and PCI Express interconnects. To enable customers' development time for AdvancedTCA and MicroTCA systems, AMCC's new reference design kit provides users with a comprehensive set of resources, including a custom-designed AMC form factor, industry-standard software development tools, open-source middleware for inter-process communications, a RapidIO network management and diagnostic tool, system-level benchmarks, and complete hardware/software design package.
Applied Micro Circuits >> http://www.amcc.com/
Why do engineers really spend so many cycles trying to fix bugs and isn’t there a better solution? To learn more, read Ed Sperling’s “Nightmares in Functional Verification.”
Chip Design Editorial Feature >> http://www.chipdesignmag.com/display.php?articleId=2166
Accounting for on-chip thermal effects, which are already a problem at 65 nm, will become a requirement when implementing 45- and 32-nm technologies. To learn more, read Peter McCrorie’s “On-Chip Thermal Analysis Is Becoming Mandatory.”
iDesign Editorial Feature >> http://www.chipdesignmag.com/display.php?articleId=2171
Green Electronics Design and Manufacturing
By Sammy G. Shina
ISBN: 0071495940
Publisher: McGraw-Hill Professional
This resource book brings together contributions from a team of experts in the electronics supply chain who demonstrate how to master the strategy, design, test, and implementation issues of meeting global environmental regulations. Edited by the founder of the New England Lead-Free Consortium, Green Electronics Design and Manufacturing features guidance for lead-free conversions, while maintaining quality and reliability for printed circuit board production and rework of surface-mount technology and plated through holes. Also included are guides on meeting RoHS compliance for hex-chrome and future halogen free issues, detailed coverage of global environmental regulations and their impact on manufacturing and design processes. techniques for managing corporate strategy and project design teams for green products, and methods for testing and analyzing green products.
McGraw-Hill Professional >> http://www.mhprofessional.com/
Great Lakes Symposium on VLSI (GLSVLSI)
May 4-6, 2008
Orlando, FL
http://www.glsvlsi.org/
World Wireless Conference
Fairmont Hotel, San Jose, CA
May 14-16, 2008
http://delson.org/wc/
International Symposium on Circuits and Systems (ISCAS 2008)
Sheraton Seattle Hotel, Seattle, WA
May 18-21, 2008
http://www.iscas2008.org/
International Interconnect Technology Conference
June 1-4, 2008
Hyatt Regency, Burlingame, CA
http://www.his.com/~iitc/
Design Automation Conference (DAC)
Anaheim Convention Center, Anaheim, CA
June 8-13, 2008
http://www.dac.com/45th/
Semicon West
Moscone Center, San Francisco, CA
July 15-17, 2008
http://semiconwest.semi.org/
IEEE RFIC Symposium
Atlanta, GA
June 15-17, 2008
http://www.rfic2008.org/
Flash Memory Summit
Santa Clara Marriott, Santa Clara, CA
August 12-14, 2008
http://www.flashmemorysummit.com/
Signal and Image Processing (SIP 2008)
Kailua-Kona, HI
August 18-20, 2008
http://www.iasted.org/conferences/ipc-623.html
Circuits and Systems (CSS 2008)
Kailua-Kona, HI
August 18-20, 2008
http://www.iasted.org/conferences/ipc-625.html
Intel Developer Forum
Moscone Center West, San Francisco, CA
August 19-20, 2008
http://www.intel.com/idf/
Hot Chips
Memorial Auditorium, Stanford University
August 24-26, 2008
http://www.hotchips.org/hc20/
IEEE Custom Integrated Circuits Conference
DoubleTree Hotel, San Jose, CA
September 21-24-, 2008
http://www.ieee-cicc.org/
Embedded Systems Conference Boston
October 27-30, 2008
Hynes Convention Center, Boston, MA
http://www.embedded.com/esc/boston/
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