Archive for July, 2012

Getting the Most From Process, Lithography, and Device Advances

Friday, July 13th, 2012
Advances in materials and the equipment needed to manufacture ICs and photovoltaic products (lithography systems, etchers, implanters, etc.), as well as many other related technologies were all on display at this week’s Semicon West and Intersolar conferences held at the Moscone Conference Center in San Francisco. Many of the exhibitors provided a look at many of the process and implementation challenges and market opportunities that the next generation of equipment solutions will tackle. Major research organizations such as IMEC International, a large research and development organization based in Leuven, Belgium, and LETI in Grenoble, France, and still other companies, examined various market areas and the challenges in those markets that designers face when crafting solutions.

One common theme that all the research organizations focused on was the need to partner and collaborate earlier in the design cycle — designing the next generation of complex ICs often requires earlier access to process and device models since the design complexity continues to increase for each next-smaller process node. Each new generation of ICs depends on advanced transistor structures, advanced patterning, advanced interconnects, and wafer-level/multichip packaging. The diverse range of technologies covered by these areas requires that designers/companies partner to leverage each organization’s expertise.

In addition to the physical design, low power consumption and high-speed operation are also putting the squeeze on designers to leverage the latest process nodes, transistor structures and circuit design tricks to deliver highly-integrated low-power solutions at ever-decreasing price points. For example, Dr Aaron Thean, director of logic programs at IMEC, sees the general trend as designers move from node to node, of achieving a 25% performance increase, a 20% power reduction, a 50% area reduction, and a 15% cost reduction every two to three years, but with changing application contexts as the end-application drivers change with each generation. Today, the diverse targets include applications such as sensor networks, smart mobile devices, and large data centers employing high-performance servers.

In addition to pushing single-chip integration to the limits, still higher complexities can be achieved by leveraging packing techniques to create a “super chip” that consists of multiple chips stacked one on top of another, interconnected by through-silicon vias and both wired and high-speed optical interconnects on an interposer substrate and entire multichip structure mounted in a high-contact density package such as a ball-grid array (See diagram). To achieve such solutions advanced patterning for ever-smaller structure at 14 nm and beyond will have to leverage extreme ultraviolet lithography with dual- and even triple-patterning to draw the fine features. That will require careful co-optimization of imaging, layout, processes and design.

Proposed 3D Subsystem from IMEC

To keep the power at bay while delivering higher performance, Thean also sees advanced transistor structures based on FinFET devices and fully-depleted silicon-on-insulator substrates at the 20 and 14 nm process nodes. Beyond that, band-engineered channels are expected to deliver higher switching speeds by employing III/V materials and silicon-germanium structures to implement compound devices and quantum well structures in the 10 and 7 nm regimes. However, implementing these complex structures will also require further advances in processing and device design.

Dave Bursky
Technology Editor,
Chip Design Magazine

©2019 Extension Media. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS