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John Blyler Reports on Sunday Night!

The analysts at Gary Smith’s EDA group spoke to a large crowd following the traditional kick-off gathering on Sunday night for the Design Automation Conference (DAC).


Focusing on the 3D/TSV packaging space, Mary Olsson opened by saying that the market was “not for the weak of heart.” Cautious optimize would best describe her outlook. She included several key factors for which to watch in this evolving market. Chief among that list was that chip designers and suppliers should follow the money to discern the direction and market strength of 3D/TSV trends.


“Capital expenditures at Outsourced Semiconductor Assembly and Test (OSAT) companies is going into copper wire bonders and new test equipment for existing package technologies that may delay transition to true TSV architectures,” Olsonn explained. In true through-silicon via (TSV) interconnect technology, a vertical via passes through a silicon die. Today’s 2.5 and 3D through-mold via (TMV) packages are mostly memory die stacked onto of existing SoCs.


Momentum to true TSV technology would also become apparent by watching the value chain, where services are already being offered by many OSATs like ASE, Amkor, SPIL, STAT and ChipPac.


Gary Smith presentation covered the EDA market as a whole. Ed Sperling coveraged Smith’s talk for the System-Level Design community: “EDA’s Big Hurdles”  – JB



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