Power Trump’s Time-to-Market as Main Driver
Learning about low power design takes a lot of energy. Over the last two months, I’ve interviewed chip companies, IP vendors, EDA suppliers, power organizations, standard bodies and even software development firms.
Each of these groups have a different perspective on the low power problem. Their solutions attest to the range and variety of these perceptions. Yet they also share a common understanding about the changing landscape for electronic products, namely, that power efficiency is now a critical part of the power budget. Let me explain.
In the past, architects would divide up available power – say, battery capacity for a given usage rate – and then allocate a portion of that total power (minus a small reserve) to each block in the chip or board design.
However, today’s power budgets come with an additional caveat: each block is expected to provide a power efficiency improvement as a way to reduce previous power levels. This mandate for efficiency is needed to offset the diverging rise in feature sets with a lack of improvement in battery technology. (See “Chip Designers Scramble For Low Power Solutions,” in the April 15th Low Power Design e-letter.)
This insistence on power efficiency has forced chip block designers to accelerate their collaboration with both board-level designers and software developers (device drivers, RTOS, OS and applications).
In the past, Time-to-Market (TTM) considerations have been the big driver for system-level awareness. TTM goals have been the main reason for collaboration between hardware chip-package-board and software design teams. But this has changed. While TTM is still important, power efficiency has eclipsed it as the more critical design driver.